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A key requirement in achieving successful submicron
fabrication processes is the control of the thermal budget.
This has created a considerable interest in transient
methods of thermal processing, which minimize the negative
influence of high-temperature processes on semiconductor
crystals. In brief, transient heating derived from rapid
thermal processing can promise a lot of advantages. The
emergence of this important processing technique has led to
a rapid growth of research activities in this area involving
all types of processes. The objective of this research is to
design and develop a laboratory scale furnace system.
Experiments conducted through deposition and doping
processes on silicon wafers using the constructed system
have revealed the superiority and advantages of the system
over the conventional ones, in particular, the shorter time
scales (measured in seconds), the reasonably low
temperatures and the sheet sensitivities produced. This type
of system would open a vast scope of research at the
laboratories without the huge investment on the commercial
rapid thermal system.
Keywords:
Design, rapid thermal processing (RTP), control,
development, integrated circuit (IC).
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